Call for Papers   The Symposium>Call for Papers
 
cfp-ATS2018
The Asian Test Symposium (ATS) provides an open forum for researchers and industrial practitioners from all countries of the world to exchange innovative ideas on system, board, and device testing with design, manufacturing and field consideration in mind.
  • Analog/Mixed-Signal Test
  • Automatic Test Generation
  • Board Test and Diagnosis
  • Boundary Scan Test
  • Built-In Self-Test (BIST)
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability and Functional Safety
  • Design for Test (DFT)
  • Diagnosis and Silicon Debug
  • Economic of Test
  • Failure Analysis
  • Fault Modeling and Simulation
  • Fault Tolerance
  • GPU Test
  • High-Speed I/O Test
  • Low-Power IC Test
  • Memory Test and Repair
  • MEMS Test
  • Multi-/Many-core Processor Test
  • Nanotechnology Test
  • On-line Test
  • Power/Thermal/Reliability Issues in Test
  • Reconfigurable System Test
  • Reliability
  • RF Test
  • Hardware-oriented Security and Trust
  • Self-Repair
  • Sensor Test
  • SiP, Stacked, 3D IC Test
  • SoC Test
  • Standards in Test
  • Statistical Learning in Test
  • Test Compression
  • Test Quality
  • Test Synthesis
  • Validation and Verification
  • Yield Analysis and Enhancement

Submissions

Regular Sessions: The ATS'18 Program Committee invites original, unpublished paper submissions on the above topics. Paper submissions should be complete manuscripts, not exceeding six pages (including figures, tables, and bibliography) in a standard IEEE two-column format. A submission will be considered as evidence that, upon acceptance, the author(s) will submit a final camera-ready version of the paper for inclusion in the proceedings, and will present the paper at the symposium.Each accepted contribution must have at least one full paid registration by the time the camera ready paper is submitted for inclusion in the proceedings. ATS reserves the right to remove from the conference proceedings papers not presented at the symposium before it is submitted for inclusion to IEEE Xplore.

Submission Website

Submissions should be made electronically as a single PDF file here.

Key Dates
  • Submission deadline:
  • Notification of acceptance:
  • Camera ready manuscript:
  • May 20, 2018
  • June 30, 2018
  • July 30, 2018